| 摘要 |
PURPOSE: A printed circuit board and a manufacturing method thereof are provided to form a minute circuit pattern by minimizing an undercut phenomenon in an etching process of a seed layer which is used for forming a circuit pattern. CONSTITUTION: A printed circuit board(100) is composed of an insulating layer(110), via(120), a first seed(132), a second seed(142), and a circuit pattern(150) etc. The seed for forming the circuit pattern is formed into a two layer structure of the second seed and said the first seed. A metal layer is formed on the lower side of the insulating layer. The first seed, the second seed, the circuit pattern, and via are formed on the upper side of the insulating layer. A via hole(112) for forming via is formed by passing through the insulating layer. |
