| 摘要 |
PROBLEM TO BE SOLVED: To provide a package mold for a light emitting device which enables a relatively hard lead to be used.SOLUTION: A package mold 10 of this invention includes: a resin mold 11 having a recessed part 12 for housing a light emitting element 42; a ceramic substrate 41 which is disposed at a bottom part 125 of the recessed part 12, the ceramic substrate 41 where one surface 41a is exposed from a bottom surface 121 of the recessed part 12 and the other surface 41b is exposed from a rear surface 14 of the resin mold 11; and leads 20, 30 disposed at a lower part of the resin mold 11. The light emitting element 42 is placed on the one surface 41a of the ceramic substrate 41, and the leads 20, 30 contact with at least one side surface 413, 414 of the ceramic substrate 41 to hold the ceramic substrate 41. |
