| 摘要 |
A light emitting diode (LED) device and packaging with enhance heat conduction. An LED in a wafer level processing (WLP) package is disclosed using vias in the silicon to route the electrical connections to the LED backside and a dedicated hole in the silicon with a direct heat conduction route from the LED to the printed circuit board. Certain layers act to promote mechanical, electrical, thermal, or optical characteristics of the device. The device avoids or ameliorates heat dissipation problems found in conventional LED devices. Some embodiments include a plurality of optically permissive layers, including an optically permissive cover substrate comprising phosphors and/or quantum dots. |
