METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND ADHESIVE FOR MOUNTING FLIP CHIP

摘要

A purpose of the present invention is to provide a method for manufacturing a semiconductor device that can suppress voids and achieve high reliability. An additional purpose of the present invention is to provide an adhesive which is for mounting a flip chip and is used in the method for manufacturing the semiconductor device. The method for manufacturing the semiconductor devices has: a step 1 for positioning a semiconductor chip, having formed thereon a protruding electrode having a tip part formed from solder, on a substrate via an adhesive; a step 2 for heating the semiconductor chip to a temperature at or above the solder melting point, fusion bonding the protruding electrode of the semiconductor chip and an electrode part of the substrate, and also temporarily bonding with the adhesive; and a step 3 for eliminating voids by heating the adhesive in a pressurized atmosphere. The adhesive has an activation energy ?E found by differential scanning calorimetry and the Ozawa method of 100 kJ/mol or less, a reaction rate of 20% or less after 2 seconds at 260°C and a reaction rate of 40% or less after 4 seconds at 260°C.