| 摘要 |
PROBLEM TO BE SOLVED: To provide a resist underlay film-forming composition having heat resistance to be used for a lithography process in the manufacture of a semiconductor device.SOLUTION: The resist underlay film-forming composition comprises a polymer containing a structural unit expressed by formula (1). In formula (1), A represents a structure having carbazole; B represents a structure having an aromatic ring; C represents a structure having a hydrogen atom, an alkyl group or an aromatic ring, and B and C may mutually form a ring; and the combined structure of A, B and C includes 1 to 4 carboxyl groups or their salts or carboxylate groups. A method for manufacturing a semiconductor device is provided, the method including steps of: forming an underlay film of the resist underlay film-forming composition on a semiconductor substrate; forming a hard mask thereon; further forming a resist film; forming a resist pattern by irradiation with light or an electron beam and by development; and etching and processing the substrate. |
