| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor substrate bonding device which can bond both substrates with high parallelism of one substrate with respect to the other substrate.SOLUTION: A semiconductor substrate bonding device 1 comprises: a first substrate holding table 24 for holding a first semiconductor substrate Wu; a second substrate holding table 36 for holding a second semiconductor substrate Wd; a first drive mechanism 46 for driving the second substrate holding table 36 to move around one axis in a tilting manner; a second drive mechanism 48 for driving the second substrate holding table 36 to move around the other axis in a tilting manner; and a control unit 90 for controlling drive of the first and second drive mechanisms 46, 48. The control unit 90 calculates force components around the one and the other axis of force acting from the second semiconductor substrate Wd on the second substrate holding table 36 when both substrates contact each other; and repeatedly drives the first and second drive mechanisms 46, 48 on the basis of respective force components to bond both substrates with high parallelism. |
