| 摘要 |
The present invention is a wafer processing method for processing a wafer secured to a support plate using an adhesive composition, wherein the invention is intended to provide a wafer processing method for maintaining adequate adhesive strength during wafer processing even for a wafer processing step for performing chemical processing, heat processing, or processing accompanying heat dissipation, and enabling the support plate to be separated from the wafer without damaging or leaving adhesive deposits on the wafer after wafer processing has concluded. The present invention has: a support-plate-securing step for securing the wafer to the support plate using an adhesive composition containing a curable adhesive component that is crosslinked and cured under exposure to light or heat; an adhesive curing step for exposing the adhesive composition to light or heat to crosslink and cure the curable adhesive composition; a wafer processing step for performing chemical processing, heat processing, or processing accompanying heat dissipation; and a support-plate separation step for separating the support plate from the wafer after the processing. |
