发明名称 |
LIGHT-EMITTING DEVICE AND LIGHT-EMITTING DEVICE MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a light-emitting device which can withstand a process temperature of 500°C and over and uses a flexible glass, and provide the light-emitting device.SOLUTION: A light-emitting device manufacturing method comprises: attaching a second substrate to a support substrate by using an adsorbed layer; forming an electrode for a touch panel by a transparent conductive film on a surface of the second substrate; adhering the second substrate to a back plane substrate on which a transistor and a luminous element are formed; isolating a first substrate from the back plane substrate which has a peeling layer and a buffer layer by peeling between the peeling layer and the buffer layer; adhering a flexible third substrate to a surface of the buffer layer, which is exposed by the isolation by using a second adhesive layer; and isolating the support substrate from the second substrate by isolation between the second substrate and the adsorbed layer. |
申请公布号 |
JP2014029853(A) |
申请公布日期 |
2014.02.13 |
申请号 |
JP20130138734 |
申请日期 |
2013.07.02 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
HIRAKATA YOSHIHARU |
分类号 |
H05B33/10;H01L51/50;H05B33/02;H05B33/04;H05B33/12;H05B33/22 |
主分类号 |
H05B33/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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