发明名称 LIGHT-EMITTING DEVICE AND LIGHT-EMITTING DEVICE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a light-emitting device which can withstand a process temperature of 500°C and over and uses a flexible glass, and provide the light-emitting device.SOLUTION: A light-emitting device manufacturing method comprises: attaching a second substrate to a support substrate by using an adsorbed layer; forming an electrode for a touch panel by a transparent conductive film on a surface of the second substrate; adhering the second substrate to a back plane substrate on which a transistor and a luminous element are formed; isolating a first substrate from the back plane substrate which has a peeling layer and a buffer layer by peeling between the peeling layer and the buffer layer; adhering a flexible third substrate to a surface of the buffer layer, which is exposed by the isolation by using a second adhesive layer; and isolating the support substrate from the second substrate by isolation between the second substrate and the adsorbed layer.
申请公布号 JP2014029853(A) 申请公布日期 2014.02.13
申请号 JP20130138734 申请日期 2013.07.02
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 HIRAKATA YOSHIHARU
分类号 H05B33/10;H01L51/50;H05B33/02;H05B33/04;H05B33/12;H05B33/22 主分类号 H05B33/10
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