| 摘要 |
The invention relates to a multilayer film capacitor (1), comprising: an essentially parallelepiped capacitor structure (2), formed by a stack of metallised dielectric film layers (20, 21), electrically conducting layers (6, 7), commonly called terminals, each formed by transverse faces (4, 5) of the capacitor structure (2) such as to totally cover said transverse faces (4, 5). The capacitor is characterised in that at least one layer of nickel (9) and at least one layer of tin or tin/lead (10) covers each of the terminals (6, 7), the capacitor structure (2) is impregnated with at least one non-conducting sealing agent, at least one electrically-conducting intermediate layer (11) is placed between each terminal (6,7) and the corresponding layer of nickel (9) and the intermediate layer (11) may take up metal deposits by means of electrolysis. |
