| 摘要 |
PROBLEM TO BE SOLVED: To provide a Cu-Te sintered sputtering target that has high deflective strengh and suppresses the occurrence of trouble such as abnormal discharge, nodule, and arching by keeping segregation size in the target equal to or less than a predetermined value.SOLUTION: In a sputtering target comprised of a Cu-Te alloy sintered body composed of 40-90 at% of Te, remaining inevitable impurities, and Cu, a segregation part existing in the target, which is comprised of Cu, Te, or an intermetallic compound of these elements, has a maximum diameter of 20 μm or less. The sputtering target comprised of the Cu-Te alloy sintered body that may form a homogeneous resistance change recording layer is provided by effectively preventing cracking during sputtering and improving the target quality through improving synthesis conditions for raw material powder used for the sputtering target of the Cu-Te alloy sintered body and through controlling a pulverization method to achieve uniform composition and constitution of the target as well as improvement of deflection strength at the same time. |
