| 摘要 |
This invention relates to a use of a non-woven thermoplastic resin in combination with a curable moulding material comprising a fibrous reinforcement material and a thermoset resin material by bringing the thermoplastic resin in contact with the curable moulding material during or following assembly of the moulding material. The thermoplastic resin has a melting point below the gel temperature of the thermoset resin material to reduce the void fraction and increase the ILSS of a cured moulding manufactured from said moulding material forming a laminate structure in comparison to a cured moulding manufactured from said moulding material in which the fabric is absent forming the laminate structure. |
