| 摘要 |
PURPOSE: A semiconductor package and a method for manufacturing the same are provided to be applied to space equipment by using a lead frame as an external connection terminal. CONSTITUTION: A semiconductor chip (120) is arranged on the upper surface of a package substrate (110). The semiconductor chip is electrically connected to the package substrate. A lead frame (150) is electrically connected to the lower surface of the package substrate. A molding material (160) surrounds the upper, the lower, and the lateral surface of the package substrate. The molding material surrounds the upper and the lateral surface of the semiconductor chip. |
