SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD THEREOF AND SEMICONDUCTOR PACKAGE MANUFACTURING MOLD

摘要

According to an embodiment of the present invention, a semiconductor package may include an inner lead on which one or more electronic components are installed by one side; a mold part for sealing the electronic components and the inner lead; a plurality of outer leads extending from the inner lead and protruding from the mold part towards the outside; and a stopper on the outer lead.