| 摘要 |
The present invention relates to a method of bonding different materials comprising: a step for forming a metal compound layer where a size of a crystal grain is 10-1000 nm in a surface of a first material which is a metal material; a step for locating a second material which a user wants to bond on the first material where the metal compound layer is formed; and a step for heating, pressurizing, and bonding the first material and the second material. Therefore, binding force can be increased in comparison with using a traditional adhesive and, especially, degradation of binding force due to a thermal history can be significantly improved. |
