发明名称 Imaging system, solid-state imaging device for the imaging system, and method for manufacturing the solid-state imaging device for the imaging system
摘要 Certain embodiments provide an imaging system including a light guiding member supported on a circuit substrate so as to be capable of lighting an object, an optical image-forming member and a solid-state imaging device. The optical image-forming member is arranged on the circuit substrate so as to have an optical axis thereof parallel to the circuit substrate, is arranged on the circuit substrate so as to be able to receive reflected light from the object, emits the reflected light in an oblique direction with respect to a surface of the circuit substrate, and forms an image at a predetermined distance position. The solid-state imaging device includes a light receiving surface that is oblique with respect to the circuit substrate surface, and is mounted on the surface of the circuit substrate so as to have the receiving surface positioned at a position where the image is formed.
申请公布号 US8649072(B2) 申请公布日期 2014.02.11
申请号 US201213417452 申请日期 2012.03.12
申请人 SEKINE HIROKAZU;KABUSHIKI KAISHA TOSHIBA 发明人 SEKINE HIROKAZU
分类号 H04N1/04 主分类号 H04N1/04
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