| 摘要 |
PROBLEM TO BE SOLVED: To suppress deformation of a movable structure, which is caused after the movable structure is made operable, in a manufacturing process of the micromechanical structure.SOLUTION: A protective layer 105 used for protection of the surface of an SOI layer 103 is exposed, for example, to an active oxygen such as an oxygen plasma or UV/ozone, and thereby burned to ashes and removed. Also, the surface of the SOI layer 103 is oxidized by ashing processing of the protective layer 105 and a thin surface oxidized layer is formed, so that the surface oxidized layer is removed by the plasma exposure using inert gaseous species such as the argon plasma. Then, the whole of a chip (micromechanical structure) formed by separating a movable structure 134 into an operable state is subjected to heating treatment. |
