| 摘要 |
PROBLEM TO BE SOLVED: To improve a throughput of substrate processing using a block copolymer that includes a hydrophilic polymer and a hydrophobic polymer.SOLUTION: In the substrate processing method, heat treatment is performed on a wafer on which a polystyrene film is formed, and ultraviolet light is radiated to the polystyrene film during the heat treatment (a step S3). After that, a resist pattern is formed on the wafer using the resist film (steps S4 and S5). After that, etching treatment is performed on the polystyrene film (a step S6). After that, a neutral layer is formed on the wafer (a step S7). After that, a block copolymer is applied to the wafer, and phase separation is performed on the block copolymer and to obtain a hydrophilic polymer and a hydrophobic polymer (steps S8 and S9). After that, the hydrophilic polymer is selectively removed from the block copolymer on which phase separation is performed (a step S10). |
