ADHESIVE FILM AND SEALING METHOD FOR ORGANIC ELECTRONIC DEVICE USING SAME

摘要

The present invention relates to an adhesive film, a sealing product for an organic electronic device and a sealing method for the organic electronic device using the same and, more specifically, to an adhesive film for sealing an organic electronic device and a sealing method for the organic electronic device using the same, and the adhesive film comprises: a first adhesive layer in which a loss factor, tandelta is 1 to 5 under the temperature of 60°C to 100°C; and a second adhesive layer formed on one surface of the first adhesive layer.