发明名称 |
CIRCUIT FORMATION METHOD OF PRINTED WIRING BOARD, THERMOSETTING RESIN COMPOSITION, AND PRINTED WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide: a circuit formation method of a printed wiring board which allows formation of a fine circuit without need for a pretreatment plating step nor need for a step for polishing redundantly formed metals accompanying a plating film and a conductive coating film, and achieves good laser irradiation processability on an insulative resin layer, and good adhesion between the insulative resin layer and a circuit film; a thermosetting resin composition; and a printed wiring board.SOLUTION: The circuit formation method of a printed wiring board comprises: a reentrant structure formation step for irradiating, with an ultraviolet light laser of a nano-second-order pulse width, an ultraviolet light-absorbable insulative resin layer on a metal-clad laminate board, thereby removing the insulative resin layer and forming a reentrant structure; and a fluid dispersion coating step for coating the inside of the reentrant structure formed by the reentrant structure formation step with a fluid dispersion including metal nanoparticles according to an ink-jet method. |
申请公布号 |
JP2014027265(A) |
申请公布日期 |
2014.02.06 |
申请号 |
JP20130126429 |
申请日期 |
2013.06.17 |
申请人 |
TAIYO HOLDINGS CO LTD |
发明人 |
SHIMAMIYA AYUMI;SUMIYA TAKENORI;MURATA KATSUTO |
分类号 |
H05K3/10;H05K1/11;H05K3/00;H05K3/24;H05K3/40;H05K3/42 |
主分类号 |
H05K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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