发明名称 |
THIN FILM STACK WITH SURFACE-CONDITIONING BUFFER LAYERS AND RELATED METHODS |
摘要 |
This disclosure provides systems, methods and apparatus for a thin film stack with surface-conditioning buffer layers. In one aspect, the thin film stack includes a plurality of thin film layers each having a thickness greater than about 10 nm and a plurality of surface-conditioning buffer layers each having a thickness between about 1 nm and about 10 nm. The surface-conditioning buffer layers are alternatingly disposed between the thin film layers. Each of the surface-conditioning buffer layers are formed with the same or substantially the same thickness and composition. In some implementations, the surface-conditioning buffer layers are formed by atomic layer deposition. |
申请公布号 |
US2014036340(A1) |
申请公布日期 |
2014.02.06 |
申请号 |
US201213565688 |
申请日期 |
2012.08.02 |
申请人 |
HONG JOHN HYUNCHUL;REINES ISAK CLARK;LEE CHONG UK;CHANG TALLIS YOUNG;PAN YAOLING;CHAN EDWARD KEAT LEEM;QUALCOMM MEMS TECHNOLOGIES, INC. |
发明人 |
HONG JOHN HYUNCHUL;REINES ISAK CLARK;LEE CHONG UK;CHANG TALLIS YOUNG;PAN YAOLING;CHAN EDWARD KEAT LEEM |
分类号 |
G02B26/00;C23C16/44 |
主分类号 |
G02B26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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