RESIN COMPOSITION HAVING PHOTOCURABLE PROPERTY AND THERMOSETTING PROPERTY, AND DRY FILM SOLDER RESIST

摘要

The present invention relates to a resin composition having a photocurable property and a thermosetting property, and a DFSR, wherein the resin composition enables the formation of a DFSR having a micro-undulated surface without an extra treating process such as a plasma treating process. The resin composition having a photocurable property and a thermosetting property comprises: an acid modified oligomer having a carboxyl group (-COOH) and an unsaturated functional group which can be photocured; a polyimide-based resin; a photopolymeric monomer having two or more unsaturated functional groups which can be photocured; a thermosetting binder having a functional group which can be thermoset; and a photoinitiator.