| 摘要 |
<p>This solder paste can be produced by mixing a flux which comprises a solvent, a rosin, a thixotropic agent and an activator with a solder powder which has a mean particle diameter of 0.1 to 5mum. The solder powder is composed of composite particles, each of which comprises: a core; a first covering layer which consists of a copper-tin intermetallic compound and which covers at least a part of the core; and a second covering layer which consists of tin and which covers all the exposed surfaces of the core and the first covering layer. The core has a single structure which consists of a silver-tin intermetallic compound. The activator contains, relative to 100 mass% of the flux, 0.3 to 0.6 mass% of a hydrohalic acid amine salt and 0.1 to 10 mass% of a compound other than hydrohalic acid amine salts, said compound being an amine, an organohalogen compound, an organic acid, an organic acid ammonium salt, an organic acid amine salt or the like.</p> |
