| 摘要 |
<p>An LED device is disclosed in which an LED chip is encapsulated in a encapsulant. The LED device includes an LED chip mounted on a support and electrically connected and an encapsulant encapsulating the LED chip, wherein the encapsulant is a transparent amorphous solid made of a metal oxide, and the solid contains as a major component at least one metal oxide selected from the group consisting of Al 2 O 3 , MgO, ZrO, La 2 O 3 , CeO, Y 2 O 3 , Eu 2 O 3 , and ScO.</p> |
