PRESSURE-SENSITIVE ADHESIVE, PRESSURE-SENSITIVE ADHESIVE SHEET, MULTILAYERED PRESSURE-SENSITIVE ADHESIVE SHEET, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

摘要

A multi-layered adhesive sheet includes a substrate film, an adhesive layer formed by coating an adhesive having a specific composition onto the substrate film, and a die attachment film laminated on the adhesive layer. The multi-layered adhesive sheet employing an adhesive having this specific composition is superior in retention of a die chip during dicing of a silicon wafer, the multi-layered adhesive sheet is less likely to come off a ring frame during the dicing of the silicon wafer, and it allows for the die attachment film and the adhesive layer to be easily peeled apart during a pick-up operation of a die chip.