| 摘要 |
A substrate processing apparatus reduces over-heating of a substrate transfer robot and suppresses deterioration of reliability or lifespan of the substrate transfer robot. The substrate processing apparatus includes a transfer chamber having a substrate transferred thereinto under a negative pressure; a process chamber connected to the transfer chamber and configured to heat the substrate; a transfer robot installed in the transfer chamber and configured to transfer the substrate into and out of the process chamber; and a cooling unit configured to cool an inner wall of the transfer chamber. |
