发明名称 |
Integrated circuit package system having perimeter paddle |
摘要 |
An integrated circuit package system comprising: forming a paddle having a hole and an external interconnect; mounting an integrated circuit device having an active side to the paddle with the active side facing the paddle and the hole; connecting a first internal interconnect between the active side and the external interconnect through the hole; and encapsulating the integrated circuit device, the paddle, the first internal interconnect, and the external interconnect with the external interconnect partially exposed. |
申请公布号 |
US8643157(B2) |
申请公布日期 |
2014.02.04 |
申请号 |
US20070766771 |
申请日期 |
2007.06.21 |
申请人 |
TAY LIONEL CHIEN HUI;CAMACHO ZIGMUND RAMIREZ;PISIGAN JAIRUS LEGASPI;STATS CHIPPAC LTD. |
发明人 |
TAY LIONEL CHIEN HUI;CAMACHO ZIGMUND RAMIREZ;PISIGAN JAIRUS LEGASPI |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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