| 发明名称 |
Lead frame with grooved lead finger |
| 摘要 |
A lead finger of a lead frame has a number of channels or grooves in a portion of its top surface that provide a locking mechanism for securing a bond wire to the lead finger. The bond wire may be attached to the lead finger by stitch bonding. |
| 申请公布号 |
US8643159(B2) |
申请公布日期 |
2014.02.04 |
| 申请号 |
US201213441924 |
申请日期 |
2012.04.09 |
| 申请人 |
WONG WAI KEONG;CHAN KOK LEONG;CHAN WEI KEE;FREESCALE SEMICONDUCTOR, INC. |
发明人 |
WONG WAI KEONG;CHAN KOK LEONG;CHAN WEI KEE |
| 分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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