SEMICONDUCTOR SUBSTRATE WITH METALLIC PLATING FILM, AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor substrate having a metallic plating film excellent in adhesion with respect to a semiconductor substrate, and to provide a method for manufacturing the same.SOLUTION: The method for manufacturing the semiconductor substrate having the metallic plating film by applying a metallic plating to a semiconductor substrate includes: bringing the semiconductor substrate into contact with a fluorine gas under reduced pressure of 0.1-60 kPa by using the fluorine gas with a purity of 70% or more; and bringing the semiconductor element into contact with an aqueous medium, and then applying a metallic plating to the semiconductor substrate.