发明名称 CHIP ELEMENT, MULTI-LAYERED CHIP ELEMENT AND METHOD OF PRODUCING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a chip element which can be miniaturized, exhibits excellent inductance characteristics and allows easy mass production, and a method of producing the same.SOLUTION: A multi-layered chip element includes: a multi-layered body 15 in which a plurality of inner magnetic layers 62 are stacked; an inner electrode layer formed within the multi-layered body; an outer magnetic layer 100-1, 100-2 stacked on at least one of an upper surface and a lower surface of the multi-layered body; and external electrodes 20 formed on the outside of the multi-layered body and the outer magnetic layer and electrically connected to the inner electrode layer, where the outer magnetic layer is shorter than the inner magnetic layer.
申请公布号 JP2014022723(A) 申请公布日期 2014.02.03
申请号 JP20130003203 申请日期 2013.01.11
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 PARK SAN-SOO;AHN YON-GYU;PARK MN-CHOL
分类号 H01F17/00;H01F27/29;H01F41/04 主分类号 H01F17/00
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