发明名称 |
CHIP ELEMENT, MULTI-LAYERED CHIP ELEMENT AND METHOD OF PRODUCING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a chip element which can be miniaturized, exhibits excellent inductance characteristics and allows easy mass production, and a method of producing the same.SOLUTION: A multi-layered chip element includes: a multi-layered body 15 in which a plurality of inner magnetic layers 62 are stacked; an inner electrode layer formed within the multi-layered body; an outer magnetic layer 100-1, 100-2 stacked on at least one of an upper surface and a lower surface of the multi-layered body; and external electrodes 20 formed on the outside of the multi-layered body and the outer magnetic layer and electrically connected to the inner electrode layer, where the outer magnetic layer is shorter than the inner magnetic layer. |
申请公布号 |
JP2014022723(A) |
申请公布日期 |
2014.02.03 |
申请号 |
JP20130003203 |
申请日期 |
2013.01.11 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
PARK SAN-SOO;AHN YON-GYU;PARK MN-CHOL |
分类号 |
H01F17/00;H01F27/29;H01F41/04 |
主分类号 |
H01F17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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