发明名称 SOLDER
摘要 PROBLEM TO BE SOLVED: To provide solder capable of significantly improving joint strength.SOLUTION: Lead-free solder includes 1.0-5.0 wt% Bi, 1.0-5.0 wt% Sb, and the balance comprising mainly Sn, where the total sum of contents of Bi and Sb is 3.0 wt% or more.
申请公布号 JP2014018859(A) 申请公布日期 2014.02.03
申请号 JP20120163351 申请日期 2012.07.24
申请人 NIPPON GENMA:KK 发明人 HAGIO KOICHI;TAKENAKA JUNICHI
分类号 B23K35/26;C22C13/02;H05K3/34 主分类号 B23K35/26
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