发明名称 SOLID-STATE IMAGING DEVICE
摘要 PROBLEM TO BE SOLVED: To supply a stable power source to peripheral circuits of a pixel portion.SOLUTION: A solid-state imaging device 10 includes: a semiconductor layer 20 having a pixel region and a peripheral circuit region; a plurality of photodiodes 21 provided in the pixel region; a power-supply line 44 provided above a first principal surface of the semiconductor layer 20 in the peripheral circuit region; a wiring layer 46 provided below a second principal surface of the semiconductor layer 20 in the peripheral circuit region; and a plurality of through electrodes 41 provided in the peripheral circuit region and penetrating through the semiconductor layer 20. A part of the plurality of through electrodes 41 electrically connects the power-supply line 44 and the wiring layer 46.
申请公布号 JP2014022402(A) 申请公布日期 2014.02.03
申请号 JP20120156708 申请日期 2012.07.12
申请人 TOSHIBA CORP 发明人 SATO HIDEFUMI
分类号 H01L27/146;H04N5/374 主分类号 H01L27/146
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