| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board capable of satisfying various conditions as a product in terms of durability, manufacturing yield, productivity, and the like, and to provide a method of manufacturing the same.SOLUTION: In a wiring board 10, an insulating layer 16 and a wiring layer 18 are laminated on a core substrate 12. The core substrate 12 is formed of glass, and part of a side surface of the core substrate 12 is covered with a resin 12a. A bump (connection terminal) 22 for connecting to a semiconductor chip 28 is formed at an opening of a solder resist layer 20 on an upper surface of the wiring board 10. A bump (connection terminal) 24 for connecting to another wiring board is formed at an opening of a solder resist layer 20 on a lower surface of the wiring board 10. |
