| 摘要 |
PROBLEM TO BE SOLVED: To perform wire bonding and an operating test at relatively low cost.SOLUTION: A semiconductor device includes: a semiconductor substrate 9 on which an integrated circuit is formed; an internal electrode pad 2 formed at the center of a surface of the semiconductor substrate 9 and inputting and outputting a signal between the integrated circuit and an external circuit; an outer-periphery electrode pad 6 formed at an outer periphery of the surface of the semiconductor substrate 9; and pattern wiring 7 having one end connected to the internal electrode pad 2 and the other end connected to the outer-periphery electrode pad 6, and transmitting a signal between the internal electrode pad 2 and the outer-periphery electrode pad 6. |
