发明名称 MICROWAVE HEATING PROCESSING DEVICE AND PROCESSING METHOD
摘要 <p>The support device (4) of this microwave heating processing device (1) has: a tubular shaft (14) penetrating the approximate middle of the bottom (13) of a processing vessel (2) and extending to the outside of the processing vessel (2); a dielectric plate (15) provided approximately horizontally at the vicinity of the top end of the shaft (14); a plurality of support pins (16) as support members mounted removably to the peripheral edge of the dielectric plate (15); a rotation drive unit (17); and a lifting/lowering drive unit (18). The dielectric plate (15) is interposed between a wafer (W) and the bottom (13) of the processing vessel (2) in a state separated from the wafer (W), and promotes the absorption of microwaves by the wafer (W) by means of altering the state of the microwaves below the wafer (W).</p>
申请公布号 WO2014017191(A1) 申请公布日期 2014.01.30
申请号 WO2013JP66017 申请日期 2013.06.11
申请人 TOKYO ELECTRON LIMITED 发明人 IKEDA TARO;YAMASHITA JUN;HONG SEOKHYOUNG;SHIMOMURA KOUJI;HAYASHI HIROYUKI
分类号 H01L21/268;H01L21/265;H05B6/64;H05B6/74 主分类号 H01L21/268
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