发明名称 |
MICROWAVE HEATING PROCESSING DEVICE AND PROCESSING METHOD |
摘要 |
<p>The support device (4) of this microwave heating processing device (1) has: a tubular shaft (14) penetrating the approximate middle of the bottom (13) of a processing vessel (2) and extending to the outside of the processing vessel (2); a dielectric plate (15) provided approximately horizontally at the vicinity of the top end of the shaft (14); a plurality of support pins (16) as support members mounted removably to the peripheral edge of the dielectric plate (15); a rotation drive unit (17); and a lifting/lowering drive unit (18). The dielectric plate (15) is interposed between a wafer (W) and the bottom (13) of the processing vessel (2) in a state separated from the wafer (W), and promotes the absorption of microwaves by the wafer (W) by means of altering the state of the microwaves below the wafer (W).</p> |
申请公布号 |
WO2014017191(A1) |
申请公布日期 |
2014.01.30 |
申请号 |
WO2013JP66017 |
申请日期 |
2013.06.11 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
IKEDA TARO;YAMASHITA JUN;HONG SEOKHYOUNG;SHIMOMURA KOUJI;HAYASHI HIROYUKI |
分类号 |
H01L21/268;H01L21/265;H05B6/64;H05B6/74 |
主分类号 |
H01L21/268 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|