发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To connect a plurality of transistors with each other without using a common contact in a case that the plurality of transistors are adjacently arranged.SOLUTION: A third diffusion layer SD3 is partially located next to a second gate electrode GT2 in a first direction (a x direction in a figure), and is overlapped with the second gate electrode GT2 in a second direction (a y direction in the figure) orthogonal to the first direction. A first lower layer wire INC11 is overlapped with at least one of a first gate electrode GT1 and the second gate electrode GT2, and with a first diffusion layer in a plan view, and extends in the first direction (the x direction). A first contact CON1 connects the first lower layer wire INC11 with the first gate electrode GT1 and the second gate electrode GT2. A second contact CON2 connects the first lower layer wire INC11 with the third diffusion layer SD3.
申请公布号 JP2014017310(A) 申请公布日期 2014.01.30
申请号 JP20120152427 申请日期 2012.07.06
申请人 RENESAS ELECTRONICS CORP 发明人 ITO SHINYA
分类号 H01L21/8244;H01L21/8242;H01L27/10;H01L27/108;H01L27/11 主分类号 H01L21/8244
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