发明名称 DISSIPATING HEAT WITHIN HOUSINGS FOR ELECTRICAL COMPONENTS
摘要 Embodiments of various electrical housings, particularly display housings, are provided. In this regard, a representative housing, among others, includes one or more electrical components that are disposed at the housing, a thermal attachment that is designed to transfer heat generated by the one or more electrical components; and a rear enclosure that is designed to engage the thermal attachment. The rear enclosure is further designed to dissipate the heat received from the thermal attachment.
申请公布号 US2014029204(A1) 申请公布日期 2014.01.30
申请号 US201314041526 申请日期 2013.09.30
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 ATKINSON LEE WARREN
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
主权项
地址