| 摘要 |
PROBLEM TO BE SOLVED: To provide a component mounting apparatus capable of increasing the mounting tact by reducing occurrence of loss time.SOLUTION: The component mounting apparatus includes: a wafer holding part 12 for holding a wafer 2 which is diced and divided into plural parts 3; substrate holding areas AR as holding areas of substrates 4; right and left mounting heads 15 that move within each of two areas on the right and left above the substrate holding areas AR as movement ranges; right and left pickup heads 14 that pick up the parts 3 from the wafer 2 and distributes the parts 3 in right and left directions of the wafer holding parts 12; and right and left placement stages 16 that move toward the substrate holding areas side with the parts 3 placed thereon and distributed in the right and left directions by the right and left pickup heads 14. Each of the right and left mounting heads 15 sucks the parts 3 from the right and left placement stages 16 moved to the substrate holding areas AR side, moves within the right and left corresponding areas, and mounts the parts 3 onto the substrates 4 held within the substrate holding areas AR. |
