发明名称 MAGNETRON SPUTTERING DEVICE EQUIPPED WITH MAGNETRON COOLING PORTION
摘要 <p>The present invention relates to a magnetron sputtering device equipped with a magnetron cooling portion, which cools a magnetron by using a cooling gas. The present invention provides the magnetron sputtering device equipped with the magnetron cooling portion, comprising: a process chamber inside of which a substrate support is provided; the magnetron, which is provided on one side of the process chamber and comprises a first magnet portion and a second magnet portion which face each other; a power supply portion for supplying power to targets which are coupled to the first magnet portion and second the second magnet portion; and the magnetron cooling portion for supplying the cooling gas to the first magnet portion and the second magnet portion.</p>
申请公布号 WO2014017682(A1) 申请公布日期 2014.01.30
申请号 WO2012KR05986 申请日期 2012.07.26
申请人 ABYZ-R CO., LTD.;HONG, TAE-KWON;CHOI, WON-JUN;KIM, HEE-SUNG 发明人 HONG, TAE-KWON;CHOI, WON-JUN;KIM, HEE-SUNG
分类号 H01L21/203 主分类号 H01L21/203
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