发明名称 MOUNTING METHOD OF ELECTRONIC COMPONENT, COMPONENT MOUNTING HEAD AND ELECTRONIC COMPONENT MOUNTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide posture recognition method and device for shortening the mounting time of an electronic component on a circuit board, in the method and device for performing posture recognition of an electronic component.SOLUTION: The component mounting head includes holding means for holding an electronic component on a component holding surface, a light guide member, illumination means, and image pick-up means. The light guide member has an incidence plane to which illumination light enters, and an exit plane from which the illumination light exits. The illumination means illuminates the incidence plane, and the illumination light passed through the light guide member illuminates, from the exist surface, the surface of an electronic component facing the component holding surface, and the surface orthogonal to the component holding surface. The image pick-up means can achieve high throughput component mounting by means for capturing the images of the surface facing the illuminated component holding surface, and the surface facing the orthogonal surface.
申请公布号 JP2014017293(A) 申请公布日期 2014.01.30
申请号 JP20120152011 申请日期 2012.07.06
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 YOSHIDA MINORU;WATANABE MASAHIRO;KOMAIKE KUNIMUNE
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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