| 摘要 |
PROBLEM TO BE SOLVED: To provide an encapsulation resin sheet capable of obtaining a clean, smooth and flat ground surface by grinding after resin encapsulation, and to provide a manufacturing method of an electronic component package using the same, and an electronic component package obtained by the manufacturing method.SOLUTION: In an encapsulation resin sheet, after thermosetting treatment at 180°C for an hour and then having ground under a condition at 1000 m/min of a peripheral speed of a grinding tool, 100 μm feed pitch, and 10 μm cut-in depth, average surface roughness Ra of a ground surface is 1 μm or smaller, and Shore D hardness at 100°C after the thermosetting treatment is 70 or higher. |
