发明名称 |
EXTRA-THIN COPPER FOIL, METHOD FOR PRODUCING THE SAME, AND EXTRA-THIN COPPER LAYER |
摘要 |
PROBLEM TO BE SOLVED: To provide extra-thin copper foil in which the thickness precision of an extra-thin copper layer on supporting copper foil is improved.SOLUTION: The extra-thin copper foil comprises: a supporting copper foil; a peeling layer laminated on the supporting copper foil; and an extra-thin copper layer laminated on the peeling layer, and in which the thickness precision of the extra-thin copper layer measured by a weight thickness method is 3.0% or lower. |
申请公布号 |
JP2014015650(A) |
申请公布日期 |
2014.01.30 |
申请号 |
JP20120152823 |
申请日期 |
2012.07.06 |
申请人 |
JX NIPPON MINING & METALS CORP |
发明人 |
KOHIKI MICHIYA |
分类号 |
C25D7/06;C25D1/04;H05K1/09 |
主分类号 |
C25D7/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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