SEMICONDUCTOR WAFER EVALUATION METHOD, SEMICONDUCTOR WAFER EVALUATION DEVICE, AND PROBE FOR SEMICONDUCTOR EVALUATION DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor wafer evaluation method that can accurately measure the electrical characteristics regardless of the presence or absence of foreign matters or concavo-convex shapes on a surface of a semiconductor wafer and prevent damages to the semiconductor wafer.SOLUTION: There is provided a semiconductor wafer evaluation method of performing an evaluation of electrical characteristics of a semiconductor wafer by bringing mercury into contact with a surface of the semiconductor wafer. The method uses a probe 15 constituted of a fixed electrode 13 having a tip end portion 13p and a transparent covering portion 14 that covers a portion 13c other than the tip end portion 13p of the fixed electrode 13. The fixed electrode 13 is made of a metal having stronger wettability with respect to the mercury 12 than a semiconductor wafer 11 and the covering portion 14. The electrical characteristics are measured by attaching the mercury 12 to the tip end portion 13p of the fixed electrode 13 and then bringing the mercury 12 into contact with a surface 11a of the semiconductor wafer 11.