| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component which has excellent electromagnetic shieldability as an element and achieves the downsizing of the electronic component itself, and to provide a manufacturing method of the electronic component.SOLUTION: In an electronic component 1, a function circuit, signal wiring 3a electrically connected with the function circuit, and ground wiring 3b electrically connected with the function circuit and electrically connected with ground potential are formed on one surface of a circuit board formed by a piezoelectric substrate and the like. A frame member 7 is provided so as to secure a region between itself and an outer peripheral edge of a first main surface of the circuit board and enclose the function circuit. The ground wiring 3b reaches from the inner side to the outer side of the frame member 7, and a shield member 10 is provided so as to reach from a second main surface of the circuit board to the region on the first main surface through a side surface. The shield member 10 is electrically connected with the ground wiring 3b in the region at the outer side of the frame member 7. |
