| 摘要 |
A package (3) for housing a semiconductor element is provided with: a ceramic laminated body (31) having a through hole (H) that vertically penetrates the ceramic laminated body; and a heat dissipating member (32), which is fitted in the through hole (H), and which has a mounting region (R) where a semiconductor element (2) is to be mounted. Furthermore, the package (3) is provided with: a frame body (33) that is provided on the ceramic laminated body (31) such that the frame body surrounds the heat dissipating member (32); and a metal substrate (34), which is provided on the lower surface of the ceramic laminated body (31), and which has an opening (A) from which the lower surface of the heat dissipating member (32) is exposed. |
