| 摘要 |
<p>This light emitting device has a first package member, a semiconductor laser element, a second package member, a metal bump, a ferrule, and a bonding layer. The first package member has: a first insulating substrate; a first electrode, which includes a die pad section, an outer conductive section, and a connecting section; and a first sealing conductive section. The semiconductor laser element is capable of emitting laser light having a wavelength within a blue-violet to blue wavelength range. The second package member has: a second insulating substrate; a second electrode, which includes an inner conductive section, an outer conductive section, and a connecting section; and a second sealing conductive section. The metal bump connects the second electrode and the semiconductor laser element to each other. The bonding layer bonds the first sealing conductive section, the second sealing conductive section, and the ferrule to each other. The first insulating substrate and/or the second insulating substrate is provided with a recessed portion and a side-surface opening. The ferrule of an optical fiber is inserted into the side-surface opening.</p> |
