发明名称 |
Two-sided substrate lead connection for minimizing kerf width on a semiconductor substrate panel |
摘要 |
A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages. |
申请公布号 |
US8637972(B2) |
申请公布日期 |
2014.01.28 |
申请号 |
US20070760405 |
申请日期 |
2007.06.08 |
申请人 |
LIAO CHIH-CHIN;YE NING;YU CHEEMEN;CHIEN JACK CHANG;TAKIAR HEM;SANDISK TECHNOLOGIES INC. |
发明人 |
LIAO CHIH-CHIN;YE NING;YU CHEEMEN;CHIEN JACK CHANG;TAKIAR HEM |
分类号 |
H01L23/48;H01L23/52 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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