SEMICONDUCTOR CHIP HAVING IMPROVED SOLIDITY, SEMICONDUCTOR PACKAGE USING THE SAME, AND METHOD OF FABRICATING THE SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE

摘要

The present invention relates to a semiconductor chip with improved strength, a semiconductor package using the same, and a manufacturing method thereof. The semiconductor chip according to one embodiment of the present invention includes a semiconductor chip body with an arch groove on the bottom surface thereof and a nonconductive material layer which fills the arch groove.