发明名称 COMPONENT SUPPLYING DEVICE, COMPONENT MOUNTING DEVICE, METHOD FOR SUPPLYING COMPONENT, AND METHOD FOR MANUFACTURING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a component supplying device which can supply components with high work efficiency in, for example, mounting electronic components on a substrate, and also to provide a component mounting device, a method for supplying components, and a method for manufacturing a substrate.SOLUTION: A component supplying device comprises: a sending unit; a housing unit; and a notification unit. The sending unit sends a carrier tape having a tape body for housing a plurality of components and a cover tape for covering the tape body to a predetermined position. The housing unit includes a lid which can be opened and closed, and houses the cover tape separated from the tape body so as to expose the plurality of housed components at the predetermined position. The notification unit protrudes to outside of the housing unit from the closed lid by being pressed by the cover tape housed in the housing unit.
申请公布号 JP2014013861(A) 申请公布日期 2014.01.23
申请号 JP20120151341 申请日期 2012.07.05
申请人 SONY CORP 发明人
分类号 H05K13/02 主分类号 H05K13/02
代理机构 代理人
主权项
地址
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