METHOD FOR INSPECTING AND REPAIRING SUBSTRATE

摘要

The present invention relates to a substrate inspection and repair method capable of inspection a defect location through a pattern inspection of a substrate, determining whether a wire has been short circuited or cut at the defect location through image comparison and outputting a signal restoration corresponding to the determined result is carried out such that a defect portion can be automatically restored, and the method comprises: an inspection step of optically inspecting a pattern defect of a substrate and transmitting recorded information on the pattern defect; a reading step of determining whether the pattern defect has a short circuited or cut wire on the basis of the transmitted information on the pattern defect; and a restoration step of performing repair work by recognizing short circuited or cut wire information on the pattern defect.