| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive pattern formation substrate which has low contact resistance in a connection portion with a layer including a metal nanowire and has high flexibility for disposing an electrode and wiring.SOLUTION: The conductive pattern formation substrate includes: a base material 2; a nanowire layer 3 which is provided on an outer surface of the base material 2 and contains a metal nanowire 4; a relay conductive layer 8 which is provided on the nanowire layer 3 so as to contact with the metal nanowire 4; and a wiring layer 9 which is provided in contact with the relay conductive layer 8 and has smaller surface resistance than the relay conductive layer 8. The relay conductive layer 8 makes surface contact with an outer surface of the metal nanowire 4. The wiring layer 9 includes: multiple conductive fillers which at least partially contacts with the relay conductive layer 8; and a binder which supports the multiple conductive fillers in a state that the multiple conductive fillers are dispersed. |
